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Welcome to CICC-8

The International Conference on High-Performance Ceramics (CICC) series is sponsored by the Chinese Ceramic Society and aims at providing an international forum for presentation, discussion and review of the latest advance in science and technology of high-performance ceramics. During the past years, the CICC series has developed to be the largest international conference on ceramics held in China and also an important international ceramic conference in Asia. Since 1998 when the first conference, CICC-1, was held in Beijing, CICC series attracted more and more scholars and graduate students to join together and exchange information in all areas related to the recent development in the field of high-performance ceramics. More than 700 scholars and students attended the latest conference in this series, CICC-7, which was held in November of 2011.

Overview of the Past Conferences

The forthcoming CICC-8, the eighth in the CICC series, will be held in Chongqing from the 4th to 7th of November, 2013, and will continue to encourage discussion of contributions to the world of high-performance ceramics and offer ample opportunity for scientific and technical exchange, equally addressing ceramic scientists, engineers, and newcomers with a general interest in the field, including graduate students.

The technical program of the forthcoming CICC-8 will consist of invited keynotes and lectures, regular oral presentations and poster presentations. Several special workshops will also be organized.

The Organizing Committee cordially invites you to participate in the forthcoming CICC-8 and present your latest research finding in the field of high-performance ceramics.



If you intend to attend CICC-8, please complete and return the Registration Form to Conference Secretariat: cicc@tsinghua.edu.cn
Call for Workshop Proposals
Important Deadlines

Registration Form: June 1, 2013
Abstract submission: June 1, 2013
Acceptance of abstract: June 1, 2013
Early payment: Sept. 1, 2013
Hotel reservation: Sept. 30, 2013
Full-length manuscript: Oct. 25, 2013
Conference: Nov. 4 ~ 7, 2013